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Ag Sintering Technology by Boschman
Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.
Film Assisted Molding Technology by Boschman
Learn more about our Film Assisted transfer Molding equipment
Backside wafer lamination by Boschman
Learn more about backside wafer lamination and dicing of the laminated wafer
Frank Boschman at Semicon China 2019
Here you can see the interview wit Frank Boschman at the the Holland High Tech pavilion at Semicon China 2019.
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
BLOCK 161, KALLANG WAY, #01-03/08, Singapore 349247
T +65 6743 7188
Contact
E info@boschman.nl
W www.boschman.nl
