Unistar Auto-2-FF-L
Unistar Auto-2-FF-L
Fully automatic 2-strip Film Assisted Molding system designed for advanced mems, sensors, power, qfn and bga packages. This system can work with lead frames, substrates and ceramic carriers as well as individual modules.
Key specifications and values
The most universal semi-automatic sintering system for all your green, lead free die attach technologies. Silver sintering is a new die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. Resulting in high yield and high reliability.
Precise temperature control up to 320 C
Effective Sintering area 350x270mm
N2 protection integrated during the complete product handling
Guaranteed equal pressure for multi Die applications due to the
Generic tooling possible for prototyping environment
Clip Sintering capable
Fully characterized process and handling parameters
Capable to integrate customer specific processes such as hydrostatic or soft tooling
Closed loop precise pressure control and monitoring
Pressure applied only on areas where required
Enabling highest density tools with interspaces down to 400µm
Development of customer specific system enhancements
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237
T +65 6743 7188
Boschman (CN)
Advanced packaging technology
No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China
中國江苏省苏州市吴中区胥口镇子胥路188号
T +86 188 0918 5028
Contact
E info@boschman.nl
W www.boschman.nl
