Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability. Boschman is market leader for Ag-Sintering services and equipment. Because we already supported many customers with solutions for many different applications, we have in-dept knowledge and experience. Thereby we make use of unique dynamic insert technologies and offer you in-house sinter tool design, manufacturing and testing. We offer any required industrial solution including e.g. clip-sintering.

Ag-Sintering Technologies

Silver Sintering is a die-attach and bonding technology, offering a void-free, strong bond, with superior thermal and electrical conductivity. It can decrease the junction temperature (Tj) of your device up-to 100℃. In the Sinter process, being heated under the right circumstances in terms of pressure, temperature and time, the silver material changes in form from powder to a solid structure. This results in a reliable sinter bond which increases both the performance and lifetime of your device, compared to traditional solder material.

 Main advantages of our Ag-Sintering technology

• Closed loop precise pressure control and monitoring.
• Pressure applied only on areas where required.
• Guaranteed equal pressure for multi Die applications due to the patented , Silicone-free, Dynamic Insert Technology (DIT).
• Extremely long life-time of tooling resulting in very low running costs.
• Enabling highest density tools with interspaces down to 400µm.
• Largest available effective sinter area of 350x270mm, providing a high UPH.
• Supporting large variation of geometries, including clips.