Ag Sintering
About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages:
- Precise temperature control up to 320 C
- Effective Sintering area350x270mm
- Clip Sintering capable
- N2 protection integrated during the complete product handling and sinter process
- Generic tooling possible for prototyping environment
- Development of customer specific system enhancements
- Capable to integrate customer specific processes such as hydrostatic or soft tooling
- Fully characterized process and handling parameters
- Closed loop precise pressure control and monitoring
- Pressure applied only on areas where required
- Guaranteed equal pressure for multi Die applications due to the patented Dynamic Insert Technology (DIT)
- Enabling highest density tools with interspaces down to 400µm
Our technologie
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About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
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About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
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About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
About Boschman Technologies
Boschman Technologies specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation process and equipment solutions for a wide range of packages.
We regularly join forces with R&D departments of our customers to co-develop and research innovative packaging concepts. Early involvement in the development process is a prerequisite to obtain the highest quality, reliable molding processes, the lowest cost of ownership and the shortest time to market. Our focus is on the following market segments:
Do you need advice?
Feel free to contact me. You can contact me from Monday to Friday by calling 00-000 000 00 or by mail to norbert@boschman.nl.
I would be happy be of service.
Norbert Sormani
Strategic HR advisor
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Do you need advice?
Feel free to contact me. You can contact me from Monday to Friday by calling 00-000 000 00 or by mail to norbert@boschman.nl.
I would be happy be of service.
Norbert Sormani
Strategic HR advisor
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Boschman (Nl)
Advanced packaging technology
Stenograaf 3,6921 EX Duiven
The Netherlands
T +31 26 319 4900
F +31 26 319 4999
Boschman (Sg)
Advanced packaging technology
Blk 1026, Tai Seng Ave, #01-3532/3534,Tai Seng Industrial Estate, Singapore 534413
T +65 6743 7188
F +65 6743 7177
Contact
E sales@boschman.nl
W www.boschman.nl
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