Unistar Auto-2-FF-L
Unistar Auto-2-FF-L
Fully automatic 2-strip Film Assisted Molding system designed for advanced mems, sensors, power, qfn and bga packages. This system can work with lead frames, substrates and ceramic carriers as well as individual modules.
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Key specifications and values
1 or 2 chases / 2 or 4 strips
Dynamic Insert Technology for packages with exposed areas/ packages open area on the chip
Maximum Leadframe / panel dimensions 255x75mm
No, single or double film
Class 100 cleanroom option for optical devices
Secs-Gem communication package for interfacing with a customer’s MES system, production traceability and recipe management
Clamping force up to 200 tons
Very versatile system for fast and easy conversion between different packages
Metal surfaces of the mold are kept clear of molding compound
Maximum Leadframe / panel dimensions 300x100mm
Extremely long life-time of tooling resulting in very low running costs
Many options standard available for enabling fast change-overs, productivity improvements and quality assurance
Integrated de-gate tooling
Works with lead frame, substrate and ceramic carriers as well as individual modules
The use of a large variety of molding compounds, including very sticky types and liquid silicone materials
Integrated cassette handlers
Large list of system options for increasing production efficiency, process control and guaranteeing the best quality
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237
T +65 6743 7188
Boschman (CN)
Advanced packaging technology
No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China
中國江苏省苏州市吴中区胥口镇子胥路188号
T +86 188 0918 5028
Contact
E info@boschman.nl
W www.boschman.nl
