Videos
Find out more about Boschman advanced packaging technology in our videos below:
Ag Sintering Technology by Boschman
Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.
Film Assisted Molding Technology by Boschman
Learn more about our Film Assisted transfer Molding equipment
Backside wafer lamination by Boschman
Learn more about backside wafer lamination and dicing of the laminated wafer
Sintering Technology Overview
This animation provides an overview of the different Sintering Technologies Boschman can offer. Every application is unique and requires the right solution to guarantee the most optimal performance in terms of Cost, Output and Quality.
Film Assisted Molding with Individual Dynamic Inserts
This animation explains the Film Assisted Transfer Molding principle with Individual Dynamic Inserts applying an equal pressure on every single Die to keep specific areas fully exposed. This patented technology is ideal for Mems & Sensors, Optical and Power Module applications.
Frank Boschman at Semicon China 2019
Here you can see the interview wit Frank Boschman at the the Holland High Tech pavilion at Semicon China 2019.
Boschman (NL)
Advanced packaging technology
Stenograaf 3, 6921 EX Duiven
The Netherlands
T +31 26 319 4900
Boschman (SG)
Advanced packaging technology
No. 3 Kaki Bukit Crescent, #01-01, Singapore 416237
T +65 6743 7188
Boschman (CN)
Advanced packaging technology
No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China
中國江苏省苏州市吴中区胥口镇子胥路188号
T +86 188 0918 5028
Contact
E info@boschman.nl
W www.boschman.nl
