Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical, mechanical and/or optical inter-connections through (transfer-molding) package encapsulation.

The technology enables among others.

• 3D stacking
• RF interconnects
• EMC shielding
• Optical windows

The principle of Through Polymer Via in a package is based on the combination of back-end lithography, Film Assisted Molding and Dynamic Insert Technology which allows for the encapsulation of these TPV structures whilst keeping the top surface perfectly clean. This in turns enables the use of these structures in a electrical, mechanical or optical application.

TPV principle: