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Download publications

Relevant references can be found on this page.

EMS - Toward the Foundry model in packaging for the semiconductor industry

2017 - selective over-molding of a CMOS TSV wafer

Cytostretch Medical Sensor

Editorial on Ag-Sintering in Bodo Power

LpS2016 - proceedings - Koelink - smart technologies for lighting innovations

Press release Holland Venture - Boschman Group

Press Release Budatec - Boschman Group

   Boschman (NL)

Advanced packaging technology

Stenograaf 3, 6921 EX Duiven
The Netherlands

T      +31 26 319 4900

   Boschman (SG)

Advanced packaging technology

No. 21 Serangoon North Avenue 5, #02-01, Singapore 554864

T     +65 6743 7188

   Boschman (CN)

Advanced packaging technology

No. 188, Zixu Road, Xukou Town, Wuzhong District, Suzhou City, Jiangsu Province, China

中國江苏省苏州市吴中区胥口镇子胥路188号

T    +86 188 0918 5028

Contact

E      info@boschman.nl
W     www.boschman.nl

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